Technology
In the ever-evolving landscape of module packaging, New Speed stands as a beacon of technological advancement. Our commitment to staying at the forefront of cutting-edge technologies is evident in the tools, methodologies, and processes we employ to deliver innovative solutions to our clients.
At New Speed, our technology not only drives the design and manufacturing processes but is also a testament to our commitment to providing clients with solutions that embrace the future of module packaging. Explore the possibilities of advanced technology with New Speed, where innovation meets precision.
Advanced Design Tool
Cadence Allegro Advanced Package Designer-APD: Our utilization of this sophisticated design tool allows us to create intricate module packaging designs with precision and efficiency.
Autocad – Mechanical: This tool enhances our mechanical design capabilities, contributing to the overall robustness of our packaging solutions.
System in Package (SiP) Expertise
New Speed specializes in SiP technology, offering state-of-the-art solutions that integrate various components seamlessly. Our expertise spans passive components, saw filters, pre-packaged ICs, and EMI shielding, providing comprehensive SiP solutions tailored to the unique needs of our clients.
Package in Package (PiP) Innovation
New Speed pioneers Package in Package (PiP) options, offering nested packaging solutions to meet diverse integration needs. This innovation caters to applications requiring multiple levels of packaging with flexibility and efficiency.
EMI Shielding Integration
We incorporate advanced Electromagnetic Interference (EMI) shielding techniques to enhance the overall electromagnetic compatibility of our module packaging solutions.
Advanced Packaging Materials
New Speed utilizes a wide range of advanced packaging materials, carefully selected to meet the diverse requirements of module packaging. From high-performance laminate materials to specialized leadframe alloys, our expertise in material science ensures the reliability and durability of our packaging solutions. We continuously explore new materials and techniques to enhance the performance and efficiency of our packaging processes.
Comprehensive Testing and Characterization
Rigorous testing and characterization processes are integral to our technology-driven approach. We ensure that each module package meets the highest standards for performance, reliability, and longevity.
