New Speed specializes in a variety of module packaging solutions, including System in Package (SiP), Laminate Packages, Leaded Packages, Leadless Packages, and Package in Package (PiP) options.

New Speed offers cost-effective solutions, reduced package footprints, design flexibility, shorter development times, and faster time to market. Our expertise in co-designing with clients ensures optimal performance and cost-effectiveness.

New Speed employs rigorous testing and characterization processes to ensure the quality and reliability of its packaging solutions. We adhere to industry standards and utilize advanced design tools and materials to meet the highest quality standards.

Yes, New Speed works closely with clients to understand their specific project requirements and offers customized solutions tailored to meet their needs. Our team of experts collaborates with clients throughout the design and development process to ensure optimal results.

Lead times can vary depending on the complexity and scope of the project. However, New Speed is committed to providing efficient and timely services, and we strive to meet our clients’ deadlines while maintaining the highest quality standards.

Yes, New Speed values long-term relationships with its clients and provides ongoing support and assistance even after the completion of a project. Our dedicated customer support team is available to address any inquiries or concerns that may arise.

SiP technology involves integrating multiple components into a single package, offering advantages such as reduced size, increased performance, and enhanced functionality. New Speed specializes in SiP solutions, leveraging this technology to provide customized packaging options tailored to clients’ specific requirements.

Yes, New Speed has expertise in integrating Electromagnetic Interference (EMI) shielding into semiconductor packaging solutions. Our advanced techniques and materials help mitigate EMI issues, ensuring optimal performance and reliability of electronic devices.

Package in Package (PiP) options provide flexibility in integrating multiple packages within a single assembly. New Speed’s PiP solutions offer versatility and space-saving benefits, making them ideal for applications requiring complex integration and miniaturization.

Yes, New Speed provides comprehensive testing and characterization services to ensure the quality and reliability of its semiconductor packaging solutions. Our testing processes include reliability testing, thermal analysis, and performance verification to meet industry standards.

New Speed is committed to staying at the forefront of technological advancements in semiconductor packaging. We invest in research and development, participate in industry conferences, and collaborate with academic institutions to remain informed about the latest trends and innovations.

Yes, New Speed has the capacity and capability to accommodate large-scale production orders for semiconductor packaging. Our manufacturing facilities are equipped with state-of-the-art equipment and staffed by experienced professionals to ensure efficient production processes and timely delivery of orders.