Our Services

At New Speed, we offer a diverse range of cutting-edge module packaging solutions tailored to meet the unique demands of the electronic industry. Our commitment is to deliver high-quality services that go beyond conventional packaging, ensuring our clients stay at the forefront of technological advancements.

Our services extend beyond conventional packaging; we are committed to co-designing with our clients to achieve optimal solutions. Partner with New Speed for innovative module packaging services that set new standards in the electronic industry.

Collaborative Co-Design:

We believe in the power of collaboration. Our approach involves working closely with clients, understanding their unique challenges, and co-designing solutions that align with their specific requirements. This collaborative spirit enables us to create customized module packaging solutions that not only meet technical specifications but also contribute to the overall success of our clients’ projects.

Unparalleled Expertise:

Backed by a team of seasoned professionals and equipped with state-of-the-art design tools, New Speed brings unparalleled expertise to the table. Whether you are exploring System in Package (SiP) solutions, laminate, leaded, or leadless packages, our comprehensive suite of services is designed to address the diverse and intricate needs of the module industry.

Future-Ready Solutions:

In an industry where change is constant, New Speed stands as a beacon of adaptability. Our services are not just about meeting current requirements; they are about crafting future-ready solutions. By choosing New Speed, you’re not just investing in module packaging – you’re investing in a partnership that propels you confidently into the future of electronics.

System in Package (SiP) Solutions:

  • Customized SiP solutions integrating various components like passive elements, saw filters, pre-packaged ICs, and EMI shielding.
  • Advantages include cost-effective System on Chip (SoC) alternatives, reduced package footprints, and enhanced design flexibility.

Multi Die Configurations:

  • Expertise in handling multi-die configurations, whether side by side or stacked wirebond die.
  • Optimization for performance and space efficiency.

Laminate Packages:

  • Specialized packaging options based on laminate materials.
  • Tailored solutions to accommodate diverse project requirements, ensuring optimal performance and reliability.

Passive Component Integration:

  • Integration of passive components within packages to enhance overall system performance.
  • Expertise in incorporating EMI shielding for improved electromagnetic compatibility.

Package in Package (PiP) Option:

  • Offering the flexibility of nested packages to accommodate varied integration needs.
  • Suitable for applications requiring multiple levels of packaging.

Leadless Packages:

  • Innovative leadless packaging options designed for enhanced miniaturization and performance.
  • Perfect for applications where space constraints are critical.